Patent Assignment
Reel/Frame 051467/0650
Assignment of Assignor's Interest
Recorded: 2020-01-09
Pages: 7
Assignors
SAITO, NOBUYUKI
Executed: 2019-07-16
KOIBUCHI, YUKARI
Executed: 2019-07-16
NAMATAME, YUTAKA
Executed: 2019-07-15
Assignee
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
4-25, KORAKU 1-CHOME, BUNKYO-KU, TOKYO, 112-0004, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Cured Pattern Production Method, Cured Product, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Layer, and Electronic Component
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.