Patent Assignment
Reel/Frame 058345/0313
Change of Name
Recorded: 2021-12-07
Pages: 10
Assignor
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Executed: 2020-08-01
Assignee
HD MICROSYSTEMS, LTD.
4-25, KORAKU 1-CHOME, BUNKYO-KU, BUNKYO-KU, TOKYO, 112-0004, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Cured Pattern Production Method, Cured Product, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Layer, and Electronic Component
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.