Patent Assignment
Reel/Frame 051467/0780
Assignment of Assignor's Interest
Recorded: 2020-01-09
Pages: 9
Assignors
YANG, XUYI
Executed: 2019-11-21
XIAO, FUQIANG
Executed: 2019-11-21
ZHANG, CONG
Executed: 2019-11-22
WANG, KUO-CHIEN
Executed: 2019-11-22
CHIU, CHIN-TIEN
Executed: 2019-11-24
Assignee
WESTERN DIGITAL TECHNOLOGIES, INC.
5601 GREAT OAKS PARKWAY, SAN JOSE, CALIFORNIA, 95119
Covered Property
(1)
Wire Bond Pad Design for Compact Stacked-Die Package
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 26, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052025/0088 →
Release of Security Interest at Reel 052025 Frame 0088
Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0699 →
Patent Collateral Agreement - Ddtl Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
Patent Collateral Agreement - a&R Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Assignment of Assignor's Interest
May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
Change of Name
Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →