Patent Assignment
Reel/Frame 051490/0561
Assignment of Assignor's Interest
Recorded: 2020-01-13
Pages: 8
Assignors
SIR, JIUN HANN
Executed: 2019-04-19
KHOO, POH BOON
Executed: 2019-04-19
GOH, ENG HUAT
Executed: 2019-04-19
ALUR, AMRUTHAVALLI PALLAVI
Executed: 2019-10-24
MALLIK, DEBENDRA
Executed: 2019-04-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Stripped Redistrubution-Layer Fabrication for Package-Top Embedded Multi-Die Interconnect Bridge