Patent Assignment
Reel/Frame 051511/0586
Assignment of Assignor's Interest
Recorded: 2020-01-14
Pages: 3
Assignors
HSIEH, SHENG-LIN
Executed: 2019-09-11
CHEN, I-CHIH
Executed: 2019-09-11
HSIEH, CHING-PEI
Executed: 2019-09-11
CHEN, KUAN JUNG
Executed: 2019-09-11
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
TSMC NANJING COMPANY, LIMITED
16, ZIFENG ROAD, PUKOU ECONOMIC DEVELOPMENT ZONE, JIANGSU PROVINCE, NANJING, CHINA
Covered Property
(1)
Trench Etching Process for Photoresist Line Roughness Improvement