IP Library › Assignment 051583/0697
Patent Assignment
Reel/Frame 051583/0697

Assignment of Assignor's Interest

Recorded: 2020-01-22 Pages: 3
Assignors
MARTORELL, FERRAN
Executed: 2020-01-04
SUBRAMANIAM, PRASAD
Executed: 2020-01-02
Assignee
ESILICON CORPORATION
2130 GOLD STREET, SUITE 100, SAN JOSE, CALIFORNIA, 95002
Covered Property (1)
High Density Low Power Interconnect Using 3D Die Stacking
Application: 16/748,633 →
Publication: US 2021/0111113
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 3, 2020
From: ESILICON CORPORATION
To: INPHI CORPORATION
Reel/Frame 051993/0022 →
Assignment of Assignor's Interest Nov 16, 2021
From: INPHI CORPORATION
To: MARVELL ASIA PTE LTD
Reel/Frame 058126/0572 →