Patent Assignment
Reel/Frame 058126/0572
Assignment of Assignor's Interest
Recorded: 2021-11-16
Pages: 4
Assignor
INPHI CORPORATION
Executed: 2021-06-17
Assignee
MARVELL ASIA PTE LTD
TAI SENG CENTRE, 3 IRVING ROAD #10-01, SINGAPORE, 369522, SINGAPORE
Covered Property
(1)
High Density Low Power Interconnect Using 3D Die Stacking
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.