IP Library › Assignment 051993/0022
Patent Assignment
Reel/Frame 051993/0022

Assignment of Assignor's Interest

Recorded: 2020-03-03 Pages: 3
Assignor
ESILICON CORPORATION
Executed: 2020-02-28
Assignee
INPHI CORPORATION
2953 BUNKER HILL LANE, SUITE 300, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
High Density Low Power Interconnect Using 3D Die Stacking
Application: 16/748,633 →
Publication: US 2021/0111113
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 22, 2020
From: MARTORELL, FERRAN; SUBRAMANIAM, PRASAD
To: ESILICON CORPORATION
Reel/Frame 051583/0697 →
Assignment of Assignor's Interest Nov 16, 2021
From: INPHI CORPORATION
To: MARVELL ASIA PTE LTD
Reel/Frame 058126/0572 →