Patent Assignment
Reel/Frame 051588/0628
Assignment of Assignor's Interest
Recorded: 2020-01-22
Pages: 7
Assignors
KIM, HYOEUN
Executed: 2019-12-16
CHO, YONGHOE
Executed: 2019-12-16
SEO, SUNKYOUNG
Executed: 2019-12-16
YEON, SEUNGHOON
Executed: 2019-12-16
HAN, SANGUK
Executed: 2019-12-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-Stacked Semiconductor Package and Method of Manufacturing Same