Patent Assignment
Reel/Frame 051593/0058
Assignment of Assignor's Interest
Recorded: 2020-01-23
Pages: 6
Assignors
TAKAI, KENJI
Executed: 2020-01-13
MIYAZAKI, EIGO
Executed: 2020-01-14
KIM, DO YOON
Executed: 2020-01-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Slurry and Method of Manufacturing Semiconductor Device