Patent Assignment
Reel/Frame 051686/0858
Assignment of Assignor's Interest
Recorded: 2020-01-31
Pages: 6
Assignors
LIN, CHENG-MING
Executed: 2019-09-16
YEONG, SAI-HOOI
Executed: 2019-09-16
FANG, ZIWEI
Executed: 2019-09-25
CHUI, CHI ON
Executed: 2019-09-19
CHAO, HUANG-LIN
Executed: 2019-09-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Self-Aligned Metal Compound Layers for Semiconductor Devices