Patent Assignment
Reel/Frame 051716/0239
Assignment of Assignor's Interest
Recorded: 2020-02-04
Pages: 2
Assignor
LEE, SUK-WON
Executed: 2020-01-07
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Stacked Semiconductor Chips