Patent Assignment
Reel/Frame 051718/0173
Assignment of Assignor's Interest
Recorded: 2020-02-04
Pages: 7
Assignors
LIN, MING-TSE
Executed: 2020-01-30
KUO, CHUNG-HSING
Executed: 2020-01-30
CHEN, HUI-LING
Executed: 2020-01-30
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Package Structure of Semiconductor Device with Improved Bonding Between the Substrates