Patent Assignment
Reel/Frame 051771/0768
Assignment of Assignor's Interest
Recorded: 2020-02-10
Pages: 6
Assignors
LEE, SEUNG-HEON
Executed: 2019-12-06
KIM, MUNJUN
Executed: 2019-12-06
KOH, JAEKANG
Executed: 2019-12-06
HAN, TAE-JONG
Executed: 2019-12-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Using a Thermally Decomposable Layer, a Semiconductor Manufacturing Apparatus, and the Semiconductor Device