Patent Assignment
Reel/Frame 051775/0287
Assignment of Assignor's Interest
Recorded: 2020-02-11
Pages: 3
Assignors
CHOI, YUN HWA
Executed: 2020-01-30
CHO, JEONG HUN
Executed: 2020-01-30
CHOI, SOON SEONG
Executed: 2020-01-30
Assignee
JMJ KOREA CO., LTD.
102, GILJU-RO 425BEON-GIL, BUCHEON-SI, GYEONGGI-DO, 14487, KOREA, REPUBLIC OF
Covered Property
(1)
Clip, Lead Frame, and Substrate Used in Semiconductor Package Having Engraved Pattern Formed Thereon and the Semiconductor Package Comprising the Same