Patent Assignment
Reel/Frame 051786/0315
Assignment of Assignor's Interest
Recorded: 2020-02-11
Pages: 3
Assignors
KIM, JONG HOON
Executed: 2020-02-06
SUNG, KI JUN
Executed: 2020-02-06
KIM, KI BUM
Executed: 2020-02-06
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Bridge Die