Patent Assignment
Reel/Frame 051801/0865
Assignment of Assignor's Interest
Recorded: 2020-02-12
Pages: 3
Assignor
PALM, PETTERI
Executed: 2020-01-29
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package Having a Solderable Contact Pad Formed by a Load Terminal Bond Pad of a Power Semiconductor Die
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.