IP Library › Assignment 053033/0066
Patent Assignment
Reel/Frame 053033/0066

Assignment of Assignor's Interest

Recorded: 2020-06-25 Pages: 4
Assignor
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Properties (4)
RF Amplifier with Impedance Matching Components Monolithically Integrated in Transistor Die
Application: 16/219,025 →
Publication: US 2020/0195205
Electronic Test Equipment Apparatus and Methods of Operating Thereof
Application: 16/529,940 →
Publication: US 2021/0033659
Space Efficient and Low Parasitic Half Bridge
Application: 16/744,967 →
Publication: US 2021/0225745
Semiconductor Package Having a Solderable Contact Pad Formed by a Load Terminal Bond Pad of a Power Semiconductor Die
Application: 16/774,357 →
Publication: US 2021/0233837
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 12, 2020
From: CHO, EUNG SAN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 051801/0957 →
Assignment of Assignor's Interest Feb 12, 2020
From: PALM, PETTERI
To: INFINEON TECHNOLOGIES AG
Reel/Frame 051801/0865 →
Assignment of Assignor's Interest Feb 24, 2020
From: CHO, EUNG SAN; CLAVETTE, DANNY
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 051907/0097 →
Assignment of Assignor's Interest Feb 24, 2020
From: FEHLER, ROBERT; PALM, PETTERI
To: INFINEON TECHNOLOGIES AG
Reel/Frame 051907/0235 →
Assignment of Assignor's Interest Mar 3, 2020
From: WILSON, RICHARD
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 051990/0968 →
Assignment of Assignor's Interest Mar 3, 2020
From: BRECH, HELMUT
To: INFINEON TECHNOLOGIES AG
Reel/Frame 051990/0931 →
Assignment of Assignor's Interest Apr 1, 2020
From: ROCHE, KEVIN; DIY, ALFONSO; TARLAC, EFREN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 052286/0265 →
Assignment of Assignor's Interest Apr 1, 2020
From: ENI, EMANUEL-PETRE; NIEDERMEYR, JOSEF
To: INFINEON TECHNOLOGIES AG
Reel/Frame 052286/0357 →