Patent Assignment
Reel/Frame 051801/0957
Assignment of Assignor's Interest
Recorded: 2020-02-12
Pages: 3
Assignor
CHO, EUNG SAN
Executed: 2020-01-28
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property
(1)
Semiconductor Package Having a Solderable Contact Pad Formed by a Load Terminal Bond Pad of a Power Semiconductor Die
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.