Patent Assignment
Reel/Frame 051828/0360
Assignment of Assignor's Interest
Recorded: 2020-02-17
Pages: 4
Assignors
WANG, PU
Executed: 2020-01-30
KAO, CHIN-FU
Executed: 2020-01-30
LU, SZU-WEI
Executed: 2020-01-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof