Patent Assignment
Reel/Frame 051857/0713
Assignment of Assignor's Interest
Recorded: 2020-02-19
Pages: 7
Assignors
KIM, KI WOONG
Executed: 2020-01-06
SEO, HYEON WOO
Executed: 2020-01-08
SHIN, HEE JU
Executed: 2020-01-08
OH, SE CHUNG
Executed: 2020-01-08
CHO, HYUN
Executed: 2019-01-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Sputtering Apparatus and Method for Fabricating Semiconductor Device Using the Same