Patent Assignment
Reel/Frame 051859/0689
Assignment of Assignor's Interest
Recorded: 2020-02-19
Pages: 4
Assignors
SAID, RAMY NASHED BASSELY
Executed: 2020-01-23
MAKALA, RAGHUVEER S.
Executed: 2020-01-27
KANAKAMEDALA, SENAKA
Executed: 2020-01-23
ZHOU, FEI
Executed: 2020-01-23
LEE, YAO-SHENG
Executed: 2020-01-27
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Bonded Assembly Containing Metal-Organic Framework Bonding Dielectric and Methods of Forming the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →