Patent Assignment
Reel/Frame 051860/0131
Assignment of Assignor's Interest
Recorded: 2020-02-19
Pages: 3
Assignors
CHENG, CHUN-WEN
Executed: 2019-12-15
CHIN, CHI-HANG
Executed: 2019-12-15
CHANG, KUEI-SUNG
Executed: 2019-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Micro-Electro Mechanical System Device Containing a Bump Stopper and Methods for Forming the Same