IP Library Assignment 051895/0228
Patent Assignment
Reel/Frame 051895/0228

Assignment of Assignor's Interest

Recorded: 2020-02-22 Pages: 6
Assignors
WAN, ZHIMIN
Executed: 2019-11-18
YANG, JIN
Executed: 2019-11-21
CHIU, CHIA-PIN
Executed: 2019-11-08
LI, PENG
Executed: 2019-11-18
GOYAL, DEEPAK
Executed: 2019-11-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Thermally Conductive Slugs/Active Dies to Improve Cooling of Stacked Bottom Dies
Application: 16/721,809 →
Publication: US 2021/0193552
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072851/0056 →