Patent Assignment
Reel/Frame 051902/0613
Assignment of Assignor's Interest
Recorded: 2020-02-24
Pages: 6
Assignors
KANG, JUNGOO
Executed: 2019-12-23
LEE, HYUNSUK
Executed: 2019-12-23
CHO, GIHEE
Executed: 2019-12-23
AHN, SANGHYUCK
Executed: 2019-12-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices and Methods of Manufacturing the Same