Patent Assignment
Reel/Frame 051919/0570
Assignment of Assignor's Interest
Recorded: 2020-02-25
Pages: 4
Assignors
SHIH, HUNG-LING
Executed: 2020-02-11
YANG, TSUNG-YU
Executed: 2020-02-11
WU, YUN-CHI
Executed: 2020-02-11
LIU, PO-WEI
Executed: 2020-02-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Deep Trench Isolation Structure and Method of Making the Same
Patent:
11,031,303 →
Application:
16/743,300 →