Patent Assignment
Reel/Frame 051962/0669
Assignment of Assignor's Interest
Recorded: 2020-02-28
Pages: 5
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Ultrathin Solid State Dies and Methods of Manufacturing the Same