Patent Assignment
Reel/Frame 051997/0724
Assignment of Assignor's Interest
Recorded: 2020-03-03
Pages: 7
Assignors
LEE, HAKSEUNG
Executed: 2019-11-25
KIM, JINNAM
Executed: 2019-11-25
MOON, KWANGJIN
Executed: 2019-11-25
KIM, EUNJI
Executed: 2019-11-25
KIM, TAESEONG
Executed: 2019-11-25
PARK, SANGJUN
Executed: 2019-11-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Semiconductor Package