Patent Assignment
Reel/Frame 052039/0875
Assignment of Assignor's Interest
Recorded: 2020-03-06
Pages: 5
Assignors
OH, SUNG LAE
Executed: 2020-03-04
KIM, DONG HYUK
Executed: 2020-03-04
PARK, TAE SUNG
Executed: 2020-03-04
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO, ICHEON-SI, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device with Chip-to-Chip Bonding Structure