Patent Assignment
Reel/Frame 052049/0844
Assignment of Assignor's Interest
Recorded: 2020-03-09
Pages: 3
Assignors
LEE, SEUNG EUN
Executed: 2020-02-27
LEE, JIN WON
Executed: 2020-02-27
KIM, YONG HOON
Executed: 2020-02-27
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Embedded Substrate