Electronic component embedded substrate

1. An electronic component-embedded substrate comprising:

a first wiring layer;

a first electronic component disposed on the first wiring layer;

a first insulating material covering at least a portion of each of the first wiring layer and the first electronic component;

a second wiring layer disposed on the first insulating material;

a second electronic component disposed on the second wiring layer and connected to the first electronic component in an electrical parallel connection;

a second insulating material disposed on the first insulating material and covering at least a portion of each of the second wiring layer and the second electronic component; and

a first via penetrating through the first insulating material and connecting the first electronic component and the second wiring layer,

wherein the first electronic component and the second electronic component are a first passive component and a second passive component, respectively, that are connected to each other in the electrical parallel connection, and

the first and second passive components are electrically connected to a wiring layer disposed above the second passive component and to a wiring layer below the first passive component.

2. The electronic component-embedded substrate of claim 1 , wherein the first electronic component is mounted on the first wiring layer through a first connection conductor,

the second electronic component is mounted on the second wiring layer through a second connection conductor, and

the first connection conductor and the second connection conductor each comprise solder.

3. The electronic component-embedded substrate of claim 1 , wherein the second wiring layer is arranged between the first electronic component and the second electronic component in a stacking direction of the first and second insulating materials.

4. The electronic component-embedded substrate of claim 1 , further comprising a through-via penetrating through the first insulating material and connecting the first wiring layer and the second wiring layer.

5. The electronic component-embedded substrate of claim 1 , wherein each of the first electronic component and the second electronic component includes a capacitor having an electrode.

6. The electronic component-embedded substrate of claim 5 , wherein each of the first electronic component and the second electronic component includes a first electrode and a second electrode,

the first electrode of the first electronic component is connected to the first electrode of the second electronic component, and

the second electrode of the first electronic component is connected to the second electrode of the second electronic component.

7. The electronic component-embedded substrate of claim 1 , wherein the first electronic component and the second electronic component are provided as a plurality of first electronic components and a plurality of second electronic components, respectively,

wherein the plurality of first electronic components are arranged to be spaced apart from each other by a predetermined distance, and

wherein the plurality of second electronic components are arranged to be spaced apart from each other by a predetermined distance.

8. The electronic component-embedded substrate of claim 1 , wherein on a plane, the second electronic component is arranged to overlap the first electronic component in a stacking direction of the first and second insulating materials.

9. The electronic component-embedded substrate of claim 1 , further comprising a third wiring layer disposed on the second insulating material and connected to the second electronic component.

10. The electronic component-embedded substrate of claim 9 , further comprising a second via penetrating through the second insulating material and connecting the second electronic component and the third wiring layer.

11. The electronic component-embedded substrate of claim 9 , further comprising a through-via penetrating through the second insulating material and connecting the second wiring layer and the third wiring layer.

12. The electronic component-embedded substrate of claim 9 , further comprising:

a first build-up structure disposed on the second insulating material and including a first insulating layer and a fourth wiring layer; and

a second build-up structure disposed on the first insulating material and including a second insulating layer and a fifth wiring layer,

wherein the fourth wiring layer is connected to the third wiring layer, and

the fifth wiring layer is connected to the first wiring layer.

13. The electronic component-embedded substrate of claim 12 , wherein the fourth wiring layer is disposed on the first insulating layer and connected to the third wiring layer through a third via, and

the fifth wiring layer is disposed on the second insulating layer and connected to the first wiring layer through a fourth via.

14. The electronic component-embedded substrate of claim 12 , further comprising a first passivation layer and a second passivation layer disposed on the first build-up structure and the second build-up structure, respectively.

15. The electronic component-embedded substrate of claim 12 , wherein thicknesses of the first insulating layer and the second insulating layer are less than thicknesses of the first insulating material and the second insulating material, respectively.

16. The electronic component-embedded substrate of claim 1 , wherein the first insulating material and the first wiring layer are coplanar with each other on a surface of the first insulating material, opposite to an interfacial surface between the first insulating material and the second insulating material.

17. An electronic package comprising:

the electronic component-embedded substrate of claim 1 ;

a semiconductor package mounted on the electronic component-embedded substrate through at least one first electrical connection metal; and

a mainboard on which the electronic component-embedded substrate is mounted through at least one second electrical connection metal.

18. An electronic component-embedded substrate comprising:

a first insulating material enclosing one or more first passive components; and

a second insulating material disposed on the first insulating material and enclosing one or more second passive components,

wherein the one or more first passive components are connected to each other through a first wiring layer arranged on one side of the first insulating material,

the one or more second passive components are connected to each other through a second wiring layer arranged on another side of the first insulating material,

the one or more first passive components are connected to the second wiring layer through a via,

the one or more first passive components are arranged to at least partially overlap the one or more second electronic components, respectively, in a stacking direction of the first and second insulating materials,

the one or more first passive components and the one or more second passive components are connected to each other in an electrical parallel connection, and

the one or more first passive components and the one or more second passive components are electrically connected to a wiring layer disposed above the one or more second passive components and to a wiring layer below the one or more first passive components.

19. The electronic component-embedded substrate of claim 18 , further comprising a through-via penetrating through the first insulating material and connecting the first wiring layer and the second wiring layer.

20. An electronic component-embedded substrate comprising:

a first wiring layer;

a first electronic component disposed on the first wiring layer;

a first insulating material covering at least a portion of each of the first wiring layer and the first electronic component;

a second wiring layer disposed on the first insulating material;

a second electronic component disposed on the second wiring layer and connected to the first electronic component in an electrical parallel connection;

a second insulating material disposed on the first insulating material and covering at least a portion of each of the second wiring layer and the second electronic component; and

a first via penetrating through the first insulating material and connecting the first electronic component and the second wiring layer,

wherein lower portions of the first and second electronic components are connected to the first and second wiring layers by solders, respectively, and an upper portion of the first electronic component is connected to the second wiring layer by the first via.