Patent Assignment
Reel/Frame 052065/0326
Assignment of Assignor's Interest
Recorded: 2020-03-10
Pages: 4
Assignors
MIMURA, YUJI
Executed: 2020-02-28
MAEDA, HIROSHI
Executed: 2020-02-28
NISHIMURA, SATOSHI
Executed: 2020-02-28
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding System with Cleaning Apparatus for Cleaning Non-Bonding Surface of Substrate