Bonding system with cleaning apparatus for cleaning non-bonding surface of substrate
A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
1. A bonding system, comprising:
a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate;
a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate;
a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and
a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
2. The bonding system of claim 1 ,
wherein the cleaning apparatus is equipped with a polishing member configured to polish the non-bonding surface.
3. The bonding system of claim 2 ,
wherein the polishing member comprises an abrasive sheet containing diamond abrasive particles.
4. The bonding system of claim 1 ,
wherein the cleaning apparatus comprises a roughening member configured to roughen the non-bonding surface.
5. The bonding system of claim 4 ,
wherein the roughening member roughens the non-bonding surface of, between the first substrate and the second substrate, one which is deformed when the bonding is performed, except a peripheral portion thereof.
6. The bonding system of claim 1 ,
wherein the cleaning apparatus cleans at least a peripheral portion of the non-bonding surface.
7. The bonding system of claim 1 ,
wherein the cleaning apparatus comprises an embedded cleaning device disposed within the surface hydrophilizing apparatus.
8. The bonding system of claim 1 , further comprising:
an inspection apparatus configured to inspect, before the bonding is performed, presence or absence of a deposit adhering to the non-bonding surface.
9. The bonding system of claim 8 , further comprising:
a transfer device configured to transfer the first substrate and the second substrate; and
a control device configured to transfer, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, into the cleaning apparatus and the inspection apparatus in this sequence.
10. The bonding system of claim 8 , further comprising:
a transfer device configured to transfer the first substrate and the second substrate; and
a control device configured to transfer, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, into the inspection apparatus and the cleaning apparatus in this sequence.
11. The bonding system of claim 9 ,
wherein the control device transfers, between the first substrate and the second substrate, one which is found to have the deposit as a result of the inspection in the inspection apparatus, into the cleaning apparatus by using the corresponding transfer device.