Patent Assignment
Reel/Frame 052083/0010
Assignment of Assignor's Interest
Recorded: 2020-03-11
Pages: 2
Assignor
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Executed: 2020-02-18
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property
(1)
Electronic Assemblies Having A Cooling Chip Layer With Impingement Channels And Through Substrate Vias
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.