Patent Assignment
Reel/Frame 052093/0883
Assignment of Assignor's Interest
Recorded: 2020-03-12
Pages: 14
Assignors
CHENG, HSIN-LI
Executed: 2020-02-24
LIN, JYUN-YING
Executed: 2020-02-24
KALNITSKY, ALEXANDER
Executed: 2020-03-06
HUANG, SHIH-FEN
Executed: 2020-03-06
SU, SHU-HUI
Executed: 2020-02-24
HSU, TING-CHEN
Executed: 2020-02-24
CHIEN, TUO-HSIN
Executed: 2020-02-24
TSUI, FELIX YING-KIT
Executed: 2020-02-24
WU, SHI-MIN
Executed: 2020-02-24
CHANG, YU-CHI
Executed: 2020-02-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Trench Capacitor Profile to Decrease Substrate Warpage