Trench capacitor profile to decrease substrate warpage
Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a pillar structure abutting a trench capacitor. A substrate has sidewalls that define a trench. The trench extends into a front-side surface of the substrate. The trench capacitor includes a plurality of capacitor electrode layers and a plurality of capacitor dielectric layers that respectively line the trench and define a cavity within the substrate. The pillar structure is disposed within the substrate. The pillar structure has a first width and a second width less than the first width. The first width is aligned with the front-side surface of the substrate and the second width is aligned with a first point disposed beneath the front-side surface.
1. An integrated circuit (IC) comprising:
a substrate comprising sidewalls that define a trench, wherein the trench extends into a front-side surface of the substrate;
a trench capacitor comprising a plurality of capacitor electrode layers and a plurality of capacitor dielectric layers that respectively line the trench and define a cavity within the substrate; and
a pillar structure disposed within the substrate and abutting the trench, wherein the pillar structure has a first width and a second width less than the first width, wherein the first width is aligned with the front-side surface of the substrate and the second width is aligned with a first point disposed beneath the front-side surface.
2. The IC of claim 1 , wherein the width of the pillar structure continuously increases from the first point to a second point, wherein the second point is disposed beneath the first point.
3. The IC of claim 2 , wherein the width of the pillar structure continuously decreases from the second point to a third point, wherein the third point is disposed beneath the second point, and wherein the third point is aligned with a lower surface of the substrate that defines a bottom of the trench.
4. The IC of claim 1 , wherein the plurality of capacitor dielectric layers comprises an uppermost capacitor dielectric layer that continuously lines the trench and seals the cavity within the trench.
5. The IC of claim 4 , wherein the uppermost capacitor dielectric layer comprises inner sidewalls that define the cavity.
6. The IC of claim 1 , further comprising:
an insulator layer that continuously extends from the front-side surface of the substrate to the sidewalls of the substrate that define the trench, wherein the insulator layer is disposed between the trench capacitor and the substrate, wherein a thickness of the insulator layer is greater than a thickness of the capacitor electrode layers and the capacitor dielectric layers, respectively.
7. The IC of claim 6 , wherein the insulator layer continuously extends along sidewalls and an upper surface of the pillar structure.
8. The IC of claim 6 , wherein the insulator layer comprises a first dielectric material and the capacitor dielectric layers comprise a second dielectric material different than the first dielectric material.
9. The IC of claim 1 , wherein a width of the cavity continuously decreases from the first point in a direction towards a bottom surface of the trench capacitor.
10. A semiconductor structure comprising:
a substrate;
a trench capacitor comprising a plurality of capacitor electrode layers and a plurality of capacitor dielectric layers overlying a front-side surface of the substrate, wherein the capacitor electrode layers and the capacitor dielectric layers define a first trench segment and a second trench segment protruding into the substrate and further define a first cavity and a second cavity recessed into the substrate respectively at the first and second trench segments; and
a pillar structure disposed laterally between the first trench segment and the second trench segment, wherein a width of the pillar structure continuously decreases in a first direction from the front-side surface towards a bottom surface of the first and second trench segments.
11. The semiconductor structure of claim 10 , wherein the pillar structure comprises a first slanted sidewall segment, a second slanted sidewall segment, and a third slanted sidewall segment, wherein the second slanted sidewall segment is disposed vertically between the first and third slanted sidewall segments, wherein the first and third slanted sidewall segments are angled in a same direction that is opposite a direction of an angle of the second slanted sidewall segment.
12. The semiconductor structure of claim 10 , wherein widths of the first and second cavities continuously increase in the first direction.
13. The semiconductor structure of claim 10 , wherein the width of the pillar structure continuously decreases in the first direction along a first vertical distance, wherein a first width of the pillar structure is greater than the first vertical distance, and wherein the first width is aligned with the front-side surface of the substrate.
14. The semiconductor structure of claim 10 , further comprising:
an insulator layer disposed between the substrate and the first and second trench segments, wherein the insulator layer continuously extends along sidewalls and an upper surface of the pillar structure, wherein a thickness of the insulator layer continuously increases in the first direction.
15. The semiconductor structure of claim 14 , wherein the insulator layer comprises silicon dioxide and the capacitor dielectric layers respectively comprise a high-k dielectric material.
16. The semiconductor structure of claim 14 , wherein a first thickness of the insulator layer disposed along the upper surface of the pillar structure is less than a second thickness of the insulator layer disposed along a sidewall of the pillar structure.
17. The semiconductor structure of claim 10 , wherein the plurality of capacitor dielectric layers comprises an uppermost capacitor dielectric layer that abuts the first cavity and the second cavity, wherein the uppermost capacitor dielectric layer seals the first cavity and the second cavity.
18. A method for forming a trench capacitor, the method comprising:
performing a first patterning process on a front-side surface of a substrate to define an upper portion of a trench and an upper portion of a pillar structure, wherein the first patterning process is performed such that a width of the pillar structure decreases from the front-side surface to a first point below the front-side surface;
performing a second patterning process on the substrate to expand the trench and increase a height of the pillar structure; and
forming a plurality of capacitor dielectric layers and a plurality of capacitor electrode layers within the trench such that a cavity is defined between sidewalls of an uppermost capacitor dielectric layer, wherein the cavity is disposed within the trench, and wherein the uppermost capacitor dielectric layer seals the cavity.
19. The method of claim 18 , further comprising:
forming a sidewall protection layer along sidewalls of the substrate that define the trench, wherein the sidewall protection layer is formed after the first patterning process and before the second patterning process.
20. The method of claim 18 , wherein the second patterning process is performed such that the width of the pillar structure continuously decreases from a second point to a lower surface of the substrate, wherein the second point is disposed vertically beneath the first point and the lower surface of the substrate defines a bottom surface of the trench.