Semiconductor device
Disclosed herein is a semiconductor device including first and second capacitor structures formed to be spaced apart from each other on a semiconductor substrate, wherein the first capacitor structure includes a first trench formed in the semiconductor substrate, first, second, and third electrode layers disposed in the first trench, and first, second, and third dielectric layers disposed in an interlaced structure with the semiconductor substrate and the first to third electrode layers, the second capacitor structure includes a second trench formed in the semiconductor substrate, fourth, fifth, and sixth electrode layers disposed in the first trench, and fourth, fifth, and sixth dielectric layers disposed in an interlaced structure with the semiconductor substrate and the fourth to sixth electrode layers, and a connection blocking area formed between the first and second capacitor structures to block connections between elements constituting the first capacitor structure and elements constituting the second capacitor structure.
1 . A semiconductor device comprising a first capacitor structure and a second capacitor structure formed to be spaced apart from each other on a semiconductor substrate,
wherein the first capacitor structure includes a first trench formed in the semiconductor substrate, a first electrode layer, a second electrode layer, and a third electrode layer disposed in the first trench, and a first dielectric layer, a second dielectric layer, and a third dielectric layer disposed in an interlaced structure with the semiconductor substrate and the first to third electrode layers,
the second capacitor structure includes a second trench formed in the semiconductor substrate, a fourth electrode layer, a fifth electrode layer, and a sixth electrode layer disposed in the second trench, and a fourth dielectric layer, a fifth dielectric layer, and a sixth dielectric layer disposed in an interlaced structure with the semiconductor substrate and the fourth to sixth electrode layers, and
a connection blocking area formed between the first and second capacitor structures to block connections between elements constituting the first capacitor structure and elements constituting the second capacitor structure are blocked,
wherein:
the semiconductor substrate, the first dielectric layer, and the first electrode layer constitute a first sub-capacitor structure of the first capacitor structure, the first electrode layer, the second dielectric layer, and the second electrode layer constitute a second sub-capacitor structure of the first capacitor structure, and the second electrode layer, the third dielectric layer, and the third electrode layer constitute a third sub-capacitor structure of the first capacitor structure;
the semiconductor substrate, the fourth dielectric layer, and the fourth electrode layer constitute a fourth sub-capacitor structure of the second capacitor structure, the fourth electrode layer, the fifth dielectric layer, and the fifth electrode layer constitute a fifth sub-capacitor structure of the second capacitor structure, and the fifth electrode layer, the sixth dielectric layer, and the sixth electrode layer constitute a sixth sub-capacitor structure of the second capacitor structure; and
the semiconductor device further includes an interconnection structure connected to the semiconductor substrate and the first to sixth electrode layers in order to provide parallel connections between a plurality of sub-capacitor structures selected from among the first to sixth sub-capacitor structures or allow each sub-capacitor structure to serve as a single capacitor,
wherein the interconnection structure includes a contact-metal structure configured to provide a parallel connection between the first and fourth sub-capacitor structures, a parallel connection between the second and fifth sub-capacitor structures, and a parallel connection between the third and sixth sub-capacitor structures.
2 . The semiconductor device of claim 1 , wherein corresponding elements among the elements constituting the first capacitor structure and the elements constituting the second capacitor structure are formed through the same semiconductor process.
3 . The semiconductor device of claim 1 , wherein each of the first to sixth dielectric layers has a thickness profile corresponding to a predefined voltage profile according to a voltage applied to each of the first to sixth sub-capacitor structures so that a plurality of voltages with different voltage values are applied to the first and second capacitor structures.
4 . The semiconductor device of claim 1 , wherein the semiconductor substrate itself is highly doped to form a common ground electrode for the first and second capacitor structures.
5 . A semiconductor device, comprising a first capacitor structure and a second capacitor structure formed to be spaced apart from each other on a semiconductor substrate,
wherein the first capacitor structure includes a first trench formed in the semiconductor substrate, a first electrode layer, a second electrode layer, and a third electrode layer disposed in the first trench, and a first dielectric layer, a second dielectric layer, and a third dielectric layer disposed in an interlaced structure with the semiconductor substrate and the first to third electrode layers,
the second capacitor structure includes a second trench formed in the semiconductor substrate, a fourth electrode layer, a fifth electrode layer, and a sixth electrode layer disposed in the second trench, and a fourth dielectric layer, a fifth dielectric layer, and a sixth dielectric layer disposed in an interlaced structure with the semiconductor substrate and the fourth to sixth electrode layers, and
a connection blocking area formed between the first and second capacitor structures to block connections between elements constituting the first capacitor structure and elements constituting the second capacitor structure are blocked,
wherein:
the semiconductor substrate, the first dielectric layer, and the first electrode layer constitute a first sub-capacitor structure of the first capacitor structure, the first electrode layer, the second dielectric layer, and the second electrode layer constitute a second sub-capacitor structure of the first capacitor structure, and the second electrode layer, the third dielectric layer, and the third electrode layer constitute a third sub-capacitor structure of the first capacitor structure;
the semiconductor substrate, the fourth dielectric layer, and the fourth electrode layer constitute a fourth sub-capacitor structure of the second capacitor structure, the fourth electrode layer, the fifth dielectric layer, and the fifth electrode layer constitute a fifth sub-capacitor structure of the second capacitor structure, and the fifth electrode layer, the sixth dielectric layer, and the sixth electrode layer constitute a sixth sub-capacitor structure of the second capacitor structure; and
the semiconductor device further includes an interconnection structure connected to the semiconductor substrate and the first to sixth electrode layers in order to provide parallel connections between a plurality of sub-capacitor structures selected from among the first to sixth sub-capacitor structures or allow each sub-capacitor structure to serve as a single capacitor,
wherein the interconnection structure includes a contact-metal structure configured to provide parallel connections between N sub-capacitor structures selected from among the first to sixth sub-capacitor structures and allow each of the remaining M sub-capacitor structures to serve as a single capacitor (N and M are natural numbers, N≥2, and N+M=6).
6 . The semiconductor device of claim 5 , wherein each of the first to sixth dielectric layers has a thickness profile corresponding to a predefined voltage profile according to a voltage applied to each of the first to sixth sub-capacitor structures so that a plurality of voltages with different voltage values are applied to the first and second capacitor structures.
7 . The semiconductor device of claim 5 , wherein the semiconductor substrate itself is highly doped to form a common ground electrode for the first and second capacitor structures.
8 . A semiconductor device, comprising a first capacitor structure and a second capacitor structure formed to be spaced apart from each other on a semiconductor substrate,
wherein the first capacitor structure includes a first trench formed in the semiconductor substrate, a first electrode layer, a second electrode layer, and a third electrode layer disposed in the first trench, and a first dielectric layer, a second dielectric layer, and a third dielectric layer disposed in an interlaced structure with the semiconductor substrate and the first to third electrode layers,
the second capacitor structure includes a second trench formed in the semiconductor substrate, a fourth electrode layer, a fifth electrode layer, and a sixth electrode layer disposed in the second trench, and a fourth dielectric layer, a fifth dielectric layer, and a sixth dielectric layer disposed in an interlaced structure with the semiconductor substrate and the fourth to sixth electrode layers, and
a connection blocking area formed between the first and second capacitor structures to block connections between elements constituting the first capacitor structure and elements constituting the second capacitor structure are blocked,
wherein the first trench has a first length, and the second trench has a second length that is greater than the first length based on a first direction on the semiconductor substrate,
wherein the semiconductor device further comprises a first trench module,
wherein the first trench module includes the second trench and the first trench disposed at each of two sides of the second trench based on a second direction perpendicular to the first direction.
9 . The semiconductor device of claim 8 , wherein the first and second trenches are alternately disposed in at least one portion of the semiconductor substrate based on the first direction or the second direction so that an arrangement structure of the first and second trenches in the semiconductor substrate has irregularity.
10 . The semiconductor device of claim 8 , further comprising a second trench module,
wherein the second trench module includes the first trench and the second trench disposed at each of two sides of the first trench based on the second direction.
11 . The semiconductor device of claim 10 , wherein the first trench module and the second trench module are disposed adjacent to each other in the second direction, and when the adjacently disposed first trench module and second trench module are defined as a complex trench module, the first trench module is additionally disposed on one side of the complex trench module based on the first direction or the second direction, and a length direction of the additionally disposed first trench module is the second direction.
12 . A semiconductor device comprising a first mesh structure and a second mesh structure which are partitioned by a trench formed in a semiconductor substrate,
wherein a plurality of electrode layers and one or more dielectric layers disposed in an interlaced structure with the semiconductor substrate and the plurality of electrode layers are disposed in the trench, and
the first and second mesh structures include, at least partially, tapered portions, each having a width which becomes smaller toward lower portions of the first and second mesh structures,
wherein a void for stress relief with a width profile corresponding to the tapered portion is formed in the trench in which the plurality of electrode layers and the one or more dielectric layers are stacked, and
wherein the void is a free space formed by being closed by only an outermost electrode layer among the plurality of electrode layers disposed in the trench.
13 . The semiconductor device of claim 12 , wherein the outermost electrode layer is disposed along a bottom surface, a first sidewall, and a second sidewall of the trench, and the outermost electrode layer disposed along the first sidewall and the outermost electrode layer disposed along the second sidewall are brought into contact with each other at an upper side of the tapered portion due to the tapered portion, and thus an upper opening of the trench is closed to form the void.
14 . The semiconductor device of claim 13 , wherein the void is formed independently from an inter-layer dielectric (ILD) applied to the semiconductor device by portions of the outermost electrode layer in contact with each other at the upper side of the tapered portion.