Patent Assignment
Reel/Frame 052094/0293
Assignment of Assignor's Interest
Recorded: 2020-03-12
Pages: 3
Assignors
HSU, FENG-CHENG
Executed: 2020-03-06
JENG, SHIN-PUU
Executed: 2020-03-06
CHEN, SHUO-MAO
Executed: 2020-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure Having Warpage Control and Method of Forming the Same