Patent Assignment
Reel/Frame 052141/0419
Assignment of Assignor's Interest
Recorded: 2020-03-17
Pages: 8
Assignors
YASUI, TAKESHI
Executed: 2020-03-03
FUNAKI, KATSUNORI
Executed: 2020-03-03
MUROBAYASHI, MASAKI
Executed: 2020-03-03
HARADA, KOICHIRO
Executed: 2020-03-03
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium