Patent Assignment
Reel/Frame 052185/0143
Assignment of Assignor's Interest
Recorded: 2020-03-20
Pages: 4
Assignors
YEN, HAN-CHEE
Executed: 2020-03-17
LIU, YING-NAN
Executed: 2020-03-17
CHENG, MIN-YAO
Executed: 2020-03-18
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package Comprising Power Module and Passive Elements