Patent Assignment
Reel/Frame 052196/0501
Assignment of Assignor's Interest
Recorded: 2020-03-23
Pages: 4
Assignors
CHEN, JIE
Executed: 2017-08-07
YU, CHEN-HUA
Executed: 2017-08-07
YEH, DER-CHYANG
Executed: 2017-08-11
CHEN, HSIEN-WEI
Executed: 2017-08-07
CHEN, YING-JU
Executed: 2017-08-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Redistribution Layer Structures for Integrated Circuit Package