Patent Assignment
Reel/Frame 052227/0542
Assignment of Assignor's Interest
Recorded: 2020-03-25
Pages: 3
Assignors
KIM, MI-JIN
Executed: 2020-01-10
KIM, SEONG-JUN
Executed: 2020-01-10
LEE, KYO-REE
Executed: 2020-01-10
PARK, TAE-SANG
Executed: 2020-01-10
LEE, TACK-MO
Executed: 2020-01-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Modular Fingerprint Recognition Package Having Reduced Size