Modular fingerprint recognition package having reduced size
A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.
1. A fingerprint recognition package comprising:
a circuit board;
an image sensor die attached and electrically connected to the circuit board;
a light-shielding member applied to the circuit board and to side edges of the image sensor die, the light-shielding member configured to seal a periphery of the image sensor die; and
an adhesive member attached to one side of the light-shielding member, the adhesive member comprising a cohesion layer,
wherein the fingerprint recognition package is configured to use a light source emitted from a display mounted outside the fingerprint recognition package, wherein the light source is reflected by a user fingerprint, and
wherein the image sensor die is configured to detect an image of the user fingerprint.
2. The fingerprint recognition package of claim 1 , wherein the light-shielding member is cured by being irradiated with ultraviolet rays.
3. The fingerprint recognition package of claim 2 , wherein the light-shielding member is thermoset by being irradiated with heat.
4. The fingerprint recognition package of claim 3 , wherein ultraviolet-curing and thermosetting are performed together on the light-shielding member.
5. The fingerprint recognition package of claim 1 , wherein the light-shielding member is processed or removed using at least one of a laser or a router.
6. The fingerprint recognition package of claim 1 , wherein the light-shielding member blocks 90% of light in a wavelength range of 400 to 700 nm.
7. The fingerprint recognition package of claim 1 , wherein the light-shielding member includes at least one of an ultraviolet-curable polymer or a thermosetting resin.
8. The fingerprint recognition package of claim 1 , wherein the adhesive member includes at least one of urethane, acryl, or silicon.
9. The fingerprint recognition package of claim 1 , wherein the display includes a window, and the adhesive member is attached to an inner surface of the window.
10. The fingerprint recognition package of claim 1 , wherein the image sensor die further includes an optical layer on one side thereof.