IP Library › Assignment 052257/0497
Patent Assignment
Reel/Frame 052257/0497

Assignment of Assignor's Interest

Recorded: 2020-03-30 Pages: 3
Assignors
CHEN, YI-CHEN
Executed: 2020-03-05
TSENG, LEE-CHUAN
Executed: 2020-03-05
LIN, SHIH-WEI
Executed: 2020-03-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Semiconductor Device and Method of Making
Application: 16/802,704 →
Publication: US 2021/0271024