Patent Assignment
Reel/Frame 052284/0072
Assignment of Assignor's Interest
Recorded: 2020-04-01
Pages: 3
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus for Wafer-Level Packaging Using Direct Writing
Application:
16/731,365 →
Publication:
US 2021/0202334
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 1, 2020
From: SUO, PENG; LIANTO, PRAYUDI; SEE, GUAN HUEI; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 052284/0210 →
Assignment of Assignor's Interest
Aug 10, 2020
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 053444/0044 →