IP Library › Assignment 052284/0210
Patent Assignment
Reel/Frame 052284/0210

Assignment of Assignor's Interest

Recorded: 2020-04-01 Pages: 5
Assignors
SUO, PENG
Executed: 2020-01-05
LIANTO, PRAYUDI
Executed: 2020-01-02
SEE, GUAN HUEI
Executed: 2020-01-02
SUNDARRAJAN, ARVIND
Executed: 2020-03-29
LAM, LIT PING
Executed: 2020-01-02
ONG, PANGYEN
Executed: 2020-01-13
KOENTJORO, OLIVIA
Executed: 2020-01-05
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Methods and Apparatus for Wafer-Level Packaging Using Direct Writing
Application: 16/731,365 →
Publication: US 2021/0202334
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 1, 2020
From: LEI, WEI-SHENG; PARK, JUNGRAE
To: APPLIED MATERIALS, INC.
Reel/Frame 052284/0072 →
Assignment of Assignor's Interest Aug 10, 2020
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 053444/0044 →