Patent Assignment
Reel/Frame 052303/0386
Assignment of Assignor's Interest
Recorded: 2020-04-03
Pages: 4
Assignors
LEE, CHOONGHYUN
Executed: 2020-02-21
CHOE, JOONYONG
Executed: 2020-02-21
LEE, YOUNGJU
Executed: 2020-02-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same