Patent Assignment
Reel/Frame 052326/0219
Assignment of Assignor's Interest
Recorded: 2020-04-07
Pages: 7
Assignors
DIMAANO JR., ANTONIO BAMBALAN
Executed: 2018-10-30
CHARUSABHA, NATAPORN
Executed: 2018-09-18
SIRINORAKUL, SARAVUTH
Executed: 2018-09-18
JOYMAK, PREECHA
Executed: 2018-08-02
ROBLES, ROEL ADEVA
Executed: 2018-08-02
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Semiconductor Package with a Heat Spreader and Method of Manufacturing Thereof