Patent Assignment
Reel/Frame 052330/0501
Assignment of Assignor's Interest
Recorded: 2020-04-07
Pages: 5
Assignors
CHEN, HSIAO-MIN
Executed: 2019-11-01
LIU, DING-I
Executed: 2019-11-01
LIN, JYH-NAN
Executed: 2019-11-01
HSU, KAI-SHUNG
Executed: 2019-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Devices Including Formation of Adhesion Enhancement Layer