Patent Assignment
Reel/Frame 052334/0696
Assignment of Assignor's Interest
Recorded: 2020-04-07
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Manufacturing a Semiconductor Package